Tongfu Microelectronics Taps AMD Synergy
Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang facilities in 2015.
The deal gave it access to key CPU, GPU, APU, and game-console packaging platforms, including FCBGA, FCPGA, FCLGA, and MCM technologies.
It also laid the foundation for a long-term strategic alliance with AMD, placing Tongfu among the frontrunners in advanced chip packaging.
Author's summary: Tongfu Microelectronics advances in AI packaging.
- Acquired 85% of AMD's Suzhou and Penang facilities in 2015
- Gained access to key CPU, GPU, APU, and game-console packaging platforms
- Established a long-term strategic alliance with AMD